IMARC Group, a leading market research company, has recently releases report titled, “Wafer Level Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028“ The study provides a detailed analysis of the industry, including the global wafer level packaging market share, size, trends, and growth forecasts. The report also includes competitor and regional analysis and highlights the latest advancements in the market. Report Highlights:
How big is the wafer level packaging market?
| Report Attributes | Details |
| Market Size in 2022 | US$ 4.8 Billion |
| Market Forecast in 2028 | US$ 13.2 Billion |
| Growth rate (2023 to 2028) | CAGR of 18.3% |
| Base Year of the Analysis | 2022 |
| Forecast Period | 2023-2028 |
What is wafer level packaging?
Wafer level packaging (WLP) is a technique that involves attaching packaging components to integrated circuits (ICs) while they are still part of a wafer, before separating them into individual circuits. This process offers various benefits such as cost and time savings in electrical testing, as the connections are accessible on the wafer. Additionally, WLP helps reduce chip size, enables traceability, and facilitates inventory management. It is widely applied in diverse industries including aerospace, defense, electronics, information technology (IT) and telecommunication, healthcare, and automotive sectors worldwide. Request Free Sample Report (Exclusive Offer on this report): https://www.imarcgroup.com/wafer-level-packaging-market/requestsampleWhat are the growth prospects and trends in the wafer level packaging industry?
The demand for circuit miniaturization is being accelerated by the increasing adoption of high-speed and compact electronic devices. This trend currently stands as a major factor driving the market on a global scale. Furthermore, the thriving electronics industry and the widespread use of semiconductor integrated circuits (ICs) in the Internet of Things (IoT) are contributing to market growth. Additionally, the growing environmental concerns and the rising popularity of electric vehicles (EVs) are presenting lucrative opportunities for key market players to introduce automotive electronic components used in infotainment systems, powertrain control, communication, and driver assistance systems worldwide. Moreover, significant investments in research and development (R&D) activities aimed at integrating wafer level packaging (WLP) technology into 3D sensors and complementary metal oxide semiconductors (CMOS) pixel detectors are expected to further propel market expansion.What is included in market segmentation?
The report has segmented the market into the following categories: Breakup by Packaging Technology:- 3D TSV WLP
- 5D TSV WLP
- WLCSP
- Nano WLP
- Others
- Aerospace and Defense
- Consumer Electronics
- IT & Telecommunication
- Healthcare
- Automotive
- Others
- North America
- Asia-Pacific
- Europe
- Latin America
- Middle East and Africa
Who are the key players operating in the industry?
The report covers the major market players including:- Amkor Technology Inc.
- China Wafer Level CSP Co. Ltd.
- Chipbond Technology Corporation
- Deca Technologies Inc. (Infineon Technologies AG)
- Fujitsu Limited
- IQE PLC
- JCET Group Co. Ltd.
- Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.)
- Tokyo Electron Ltd.
- Toshiba Corporation.