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Proper selection and application of EMC components

Post n°30 pubblicato il 22 Luglio 2014 da fesfsd

In the complex electromagnetic environment, each electronic, electrical products in addition to their own to be able to live in some foreign anti-electromagnetic interference is working properly, it also can not produce the electromagnetic environment of other electronic and electrical products can not withstand electromagnetic interference. Or that is necessary to meet the standards prescribed limit electromagnetic sensitivity requirements, but also to meet the requirements of its electromagnetic emissions limits, this is the electronics, electrical products should solve the problem of electromagnetic compatibility, but also electronic and electrical products through the Electromagnetic Compatibility a necessary condition for certification. Electromagnetic Compatibility many engineers in product design, how to properly select and use Electromagnetic compatibility components, often helpless or are not effective, therefore, it is necessary to conduct a discussion.

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For the theory of electromagnetic compatibility, electronic components online EMC Technology Netcom Banyuetan, EMC large podium and the next line of electromagnetic compatibility seminars are many ways in depth. By now we have some pictures, recalling intuitive system electromagnetic compatibility meaning, the three elements of electromagnetic interference and electromagnetic interference suppression principle. Then according to EMC design principles and components of different structural characteristics, mainly on the different components in EMC design selection and application techniques for EMC design with guidance.

EMC definition

EMI three elements

The principle of electromagnetic interference suppression

EMC main solution is more effective than prevention shield

Electromagnetic compatibility components to solve the problem of electromagnetic interference and electromagnetic sensitivity critical launch, proper selection and use of these components is a prerequisite for good EMC design. Therefore, we must better grasp of these components, so that it may be designed to meet the standards, best price-performance electronic and electrical products. And every kind of electronic component has its own characteristics, therefore, requires careful consideration in the design. Next, we will discuss some common used to reduce or inhibit electronic components and circuit design techniques for electromagnetic compatibility.

Element group

There are two basic types of electronic components groups: with and without pin component pin. Leaded components parasitic effects, especially at high frequencies. The pin forms a small inductor, which is about 1nH/mm / pin. Terminal pins can also have a small capacitive effect, about 4pF. Therefore, the length of the pin should be as short as possible. Compared to have pin components, leadless and parasitic effects of surface mount components to be smaller. Typical values ​​are: parasitic inductance 0.5nH 0.3pF of capacitance of about terminal.

From the point of view of electromagnetic compatibility, surface mount components the best, followed by radial leaded components, and finally the element axially parallel pin.

Proper selection and application of EMC components

A capacitive element EMC

In EMC design, capacitance is one of the most widely used components, Mercedes Casino http://www.84319959.com/ mainly used to create various low-pass filter or as decoupling and bypass capacitors. A lot of practice showed that: in EMC design, proper selection and use of capacitors, EMI not only solve many problems, but also to fully reflect the effect of a good, inexpensive, easy to use advantages. If the capacitor selection or improper use, they may not reach the intended purpose, and even exacerbate the degree of EMI.

In theory, the greater the capacity of the capacitor, the smaller the capacitance, the filtering effect is better. Some people have this habit of understanding. However, the large parasitic inductance capacitance generally large, low self-resonant frequency (eg typical ceramic capacitors, 0.1μF of f0 = 5 MHz, 0.01μF of f0 = 15 MHz, 0.001μF of f0 = 50 MHz), high frequency noise decoupling effect is poor, or simply will not achieve the decoupling effect. Discrete components in the filter frequencies exceeding 10 MHz, will begin to lose performance. Physical size components, the lower turning point frequencies. These problems can be selected to address the special structure of the capacitor.

 
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