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Wireless MCU platform from Texas Instruments for battery-free IoT connection

The extremely low power Simple Link wireless platform from TI is suitable for Bluetooth Smart, 6LoWPAN, ZigBee, Sub-1 GHz ZigBee RF4CE and.

Customers would be able to do without either by energy harvesting entirely on batteries or comment in the always-on operation for several years with a single button cell. "This technique is a first in the industry and gives customers flexible development opportunities for products that support a single chip and identical RF design more radio access standards," said Oyvind Birkenes, General Manager, Wireless Connectivity Solutions at TI.

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The Simple Link Ultra-low-power platform supports Bluetooth Low Energy, ZigBee, 6LoWPAN, Sub-1 GHz ZigBee RF4CE and proprietary implementations as well as with data rates up to 5 Mbit / s. With an ARM Cortex-M3-based MCU, Flash / RAM, A / D converter, peripheral, a sensor controller, and robust security it offers a high degree of integration.

Figure 1: The wireless microcontroller from TI CC2650 supports Mehere 2.4 GHz technology Figure 2: Block diagram of the Simple Link Ultra-Low-Power Wireless MCU platform Figure 3: CC2650 DK - 2.4 GHz hardware, software and RF development platform Smart Bluetooth, ZigBee and 6LoWPAN

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The simple design of this platform is the result of immediately deployable protocol stacks, operating system, TI RTOS, the integrated development environment (IDE) Code Composer Studio, the tools, online training and support from the E2E Community, so Birkenes. The available reference designs facilitate the development and layout, so that a minimum amount of HF sufficient expertise. About the TI IoT Cloud Ecosystem TI also facilitates its customers to the cloud connection.

The first products of the Simple Link Ultra-Low-Power Wireless MCU platform of CC2640 Bluetooth Smart and CC2630 for 6LoWPAN and ZigBee. For more flexibility, the wireless MCU CC2650 can be used, which supports multiple 2.4-GHz technologies, including Bluetooth Smart, 6LoWPAN, ZigBee RF4CE and. Additional products will follow later this year, the CC1310 sub-1 GHz for the operation and the CC2620 ZigBee RF4CE.

Trimmed for low power

The ultra-low-power platform is designed for low power consumption. A dedicated onboard sensor controller speaks the external sensors to autonomously, while the rest of the block is in Sleep mode. Characteristic of the platform are less than 6.2 mA draw maximum current consumption with active radio operation and under 61 uA / MHz lying power consumption of the MCU in the active state.

The entire chip can be placed in a standby status, with only 1.1 uA current consumption for retention of memory and running real-time clock (RTC). Birkenes: "The platform comes with it to half the power of other MCUs, such as the value of 143.6 of the EEMBC benchmarks shows ULPBench A blog post includes information about how the battery-free operation can be realized.."

IBM Expert: Flash application from start cross to Tier1 level Tier0

IBM storage experts believe further depth enterprise flash applications, application data from the small stage Tier0 began to shift to the Tier1 application patterns, SSD applications and virtualization capabilities begin to integrate, but also interfacing existing storage products, will drive more business with full flash storage array that has been adopted by even full adoption.

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10 years ago, IBM sold the entire PC division last turn X86 server business selling products to the store the other hand, it is willing to invest heavily hit, when the storage industry have launched many mixed-type storage devices, IBM pioneered betting the flash memory body market, IBM Greater China recently cum technology systems Business Unit of flash memory storage solutions to solve the technical director Xu original units, exposing IBM flash memory market development strategy.

Xu original thought, application-level enterprise flash technology will push up one level up, began to shift from small data applications Tier0 stage to Tier1 application patterns, Tier1 application integration stage virtualization capabilities, can interfacing existing storage products, expect more companies will start using full-flash storage array, it will further the adoption of a comprehensive enterprise adoption.

IBM acquired in 2012 TMS (Texas Memory Systems) after the introduction of the all flash product line FlashSystem, the All-flash storage market, every year big action announced $ 1 billion will be invested, in addition to the development of new flash memory technology, flash memory technical entire body and to existing product lines among other also plans to set up 12 research centers of flash memory, providing enterprise product testing environment.

Flash memory research center to help customers do the actual testing environment and application evaluation, and based on different sizes and patterns to provide business support, including hardware and software, test tools, technical support and professional and technical personnel, accelerate business importing and applications, in addition, IBM also be opened for 600 API for independent developers to use.

Last year, IBM branched out into software-defined storage (SDS), the introduction of flexible expansion of storage software (Elastic Storage), and the layout of flash storage products for enterprise tier0, tier1 application requirements, were introduced IBM FlashSystem 840 and two IBM FlashSystem V840 section full flash storage array.

Xu Yuan said that although flash technology has emerged in 1978, but the technology has not yet reached a mature stage technology and applications, has been to the last two, three years, the price dropped to a certain extent, flash memory was really ready to enter the application stage, the first to be applied to specific applications such as networking, and now even traditional data centers have begun to use flash technology, he believes the market in flash storage technology is a disruptive innovation.

IBM has introduced in the last year of FlashSystem 840 and IBM FlashSystem V840 two full flash storage arrays, FlashSystem 840 can be optimized for the data center, the performance compared to the previous generation of products FlashSystem 820, the new system has doubled, reaching 1.1 million IOPS , nearly twice the bandwidth upgrade also for database analysis, virtualized infrastructure and public cloud and private cloud.

And FlashSystem V840 is the integration of the storage device virtualization system SVC (SAN Volume Controller), energy storage device resources for a single point of control, but also has compression, replication, automated tiered storage and on-demand resource allocation and other functions.

SVC can upgrade the existing storage facilities and the availability of additional storage devices, including the ability to deploy traditional disk in a decentralized environment, and can be standardized function virtualization storage devices. Xu Yuan said, because many corporate customers want to have additional functions, such as high-availability solutions, tiered division, compression, storage and other needs, these software functions and to FlashSystem V840 the whole solution, but this whole fast flash storage devices within the next year will be one of the main thrust of the solution.

Taiwan IBM Systems Technology Group at the Information Technology cum Associate Que Zhiming said that before storage equipment import, business users can be simulated by means of improving the effectiveness of the device after the import situation and estimate the overall effectiveness of the verification phase, in addition, IBM is also providing TCO analysis tools to help customers estimate the total cost of ownership is reduced amplitudes.

Que Zhiming also said that all storage devices have higher-order, in-order, low-order points, once the business users understand the positioning of each storage device, will be able to meet the economical way to appropriate storage device placed in the appropriate location, to maximize benefits. And he believes that companies need to consider when taking into account the storage trends, including optimization, software-defined storage, big data applications, they can be used all-flash storage solutions arrays.

He mentioned, FlashSystem 840 for enterprise application requirements for tier0, companies using flash memory to strengthen the effectiveness and shorten batch analysis time, or for database, ERP and other systems, the Flash as a cache applications, while FlashSystem V840 is for more complex enterprise IT environment, integrating virtualization products, storage devices can be integrated both functions are no longer just a cache of strengthening it, but also for the storage of flash storage devices, with the virtualization approach to interfacing different products in a storage pool for system use.

Although FlashSystem 840 and FlashSystem V840 has been launched for some time, but Taiwan's science and technology at IBM System cum business associate, said Chen Zhirong, started businesses lack a reference case, the whole flash storage device is not fully understood, after this year with customers after the run-in and accumulated practical experience, business users now Taiwan market has begun to experience the advantages of flash storage applications, and can not affect that many restructuring the situation, greatly enhance the effectiveness of the storage device.

He also revealed that there are currently three major brokerages two import flash storage devices, other home also includes bankers, manufacturing, telecommunications, government agencies, and so the case has been imported, you can see the flash storage devices have now been more customer acceptance, companies began to expand the use of the scale. He also said, IBM will focus on tier1 future applications, providing both an all flash storage device core solution.

IDC flat market outlook: the commercial market growth remains robust

December 18 morning news, big-screen phones are now so good, but also to the Tablet PC to do? Even Apple's iPad sales are beginning to fell (IDC expects iPad sales fell 12.7 percent), the tablet market there hope?
    
In the recently held "2014 Intel commercial flatbed media communication", the assistant vice president of IDC China industry research and consulting services, said Wu Lianfeng, the overall global tablet market, especially flat consumption growth slowed sharply indeed, in the past few years at every turn double drop into the single digits, but the decline in the market is not all, commercial flat growth is still very strong.
   
  In Wu Lianfeng seems flat to maintain strong growth in the commercial core of three reasons:
    
- From a macro perspective, cloud computing, big data, mobile, social, and the third among the mobile platform and the perception that the future will be extended to the endless intelligent edge. So with the mobile-related products and services with smart phones, tablet-related will have a good future growth.
    
Two smart phones for business solutions have a lot of deficiencies. (AD7401)"Mobile phone for business, then the screen is too small; secondly it is safe, especially for time industrial applications, security is still relatively poor; the third is the performance of the phone is still worse than the flat; Fourth, compatibility, some office software or enterprise class application compatibility will be relatively poor. "
    
Third, the Tablet PC in the business which will have a lot of advantages.(surt5000xlt) From the user's point of view, close to half of the CIO believes big screen to facilitate business processes; more on performance flat enough to support commercial office, if it is, then the x86 architecture, with existing business applications will be good overall compatibility; tablet can be directly industry custom made, and these are the phone difficult to do.
    
Wu lianfeng In his speech, also described IDC for the future development trend of commercial flat-panel market.
    
First, the style will be personalized, will be more numerous, the entire tablet style will be more; the second, from the operating system, the future is in the three pillars of the situation; and third, the next tablet peripheral devices will become more and more abundant; fourth, industry solutions will be stimulated; fifth, security management will become increasingly important; sixth, commercial pricing model innovation.

Infineon: Arduino Shields for RGB lighting applications and motor controllers

The Infineon RGB LED Lighting Shield for Arduino is equipped with the microcontroller XMC1202 that has a Brightness Color Control Unit (BCCU) for the LED lighting control. The Shield for high current DC motor controllers for Arduino uses the high current half-bridge driver NovalithIC BTN8982TA.

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The RGB LED Lighting Shield with XMC1202

The module for RGB LED lighting enables the control of different LED light sources. It has three independent output channels for flicker control of multi-colored LEDs. The Shield is based on the microcontrollers XMC1202 from the XMC1200 series. This series provides, inter alia, the complete dimming control and flicker-free light over all Dimmungsstufen. Expand the shield can be a DMX communication interface for integration with lighting and audio systems. Also possible is the combination with a 24 GHz radar sensor, for example for motion detection.

DC Motor Control Shield with BTN8982TA

This Shield is half-bridge and full-bridge designs can be evaluated. It can drive two DC motors unidirectional or bidirectional DC motor. Fitted is the shield with two fully integrated high current half-bridge drivers for motor control of the type NovalithIC BTN8982TA. This combines three integrated circuits in a single package: two power ICs (a P-channel high-side MOSFET and an N-channel low-side MOSFET) and an integrated driver IC with a logic circuit for the power control and their monitoring. Other features include diagnostic functions such as current measurement, adjustability of the slew rate, dead-time generation and protection functions at overtemperature, undervoltage, overcurrent and short circuit.

The Novalith IC BTN8982TA is ideal for secure high-current PWM motor drives, which should be as small as possible and supports high-frequency pulse width modulation, for example, up to 30 kHz. Brushed DC motors can be operated up to 250 W continuous power (eg 12 V / 20 A). The current limitation of BTN8982TA can peak currents up to 55 A.

Until the end of January 2015, the two Shields Farnell Newark element14 and element14 are to relate. Then the two Arduino Shields will also be available by Infineon and its distributors.

STMicroelectronics (ST) has launched a new M-Series IGBT

STMicroelectronics (STMicroelectronics, called ST; NYSE: STM) has launched a new M Series 1200V IGBT, advanced trench-gate type field stop technology (trench-gate field-stop) features, effectively raising the solar inverter (solar inverters), welding (welding equipment), uninterruptible power supplies (uninterruptible power supplies) and motor drivers and many other industrial applications, energy efficiency goals and reliability.

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Highly optimized continuity and off resistance and low conduction losses (low turn-on loss), so that the new IGBT is particularly suitable for the implementation of improved operating frequency up to 20kHz for hard switching circuit (hard-switching circuit); maximum working raising the temperature to 175 ° C, a wide range of safety work (SOA, safe operating area) without blocking effect (latch-up free), short-circuit withstand time (short-circuit withstand time) 150 ° C for at 10μs, these features ensure the new products with higher reliability in harsh external electrical environment.

New products used in third-generation technology, including new advanced trench gate structure architecture design and optimization of high-voltage IGBT can minimize the voltage overshoot (voltage overshoot), the elimination of oscillations (oscillation) that occur during shutdown, effective reduce power consumption, simplify circuit design. At the same time, low saturation voltage (Vce (sat)) to ensure that the new products with high conduction efficiency. Positive temperature coefficient and a narrow range of saturation voltage simplifies the design of new products in parallel, contribute to improve the power handling capability.

The new products also benefit from the upgrade of conducting energy efficiency. In addition, new products and IGBT reverse parallel (anti-parallel) with a new generation of diode package, with fast recovery time and enhanced recovery softness characteristics, and no significant increase in conduction losses, thus achieving better EMI performance .

40A STGW40M120DF3,25A STGW25M120DF3 and 15A STGW15M120DF3 three products using standard TO-247 package, STGWA40M120DF3, STGWA25M120DF3 and STGWA15M120DF3 three products using long-pin TO-247 package, are currently in mass production.